Cryogenic 3D Packaging Lead Quantum Modules
Listed on 2026-10-11
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Engineering
Packaging Engineer, Research Scientist
Jobtailor seeks a senior packaging and R&D leader to drive 3D integration for multi-chip quantum modules. You will build and guide a team across packaging, signal integrity, materials, and quantum integration, coordinating with external foundries and research partners to deliver robust, cryogenic-ready solutions.
Your work will balance rapid prototyping with rigorous reliability, yield, and long-term stability, partnering with design, process integration, cryo R&D, and quantum hardware teams.
We have an opening for a Cryogenic 3D Packaging Lead for Quantum Modules in Greater London, England, United Kingdom within Engineering.
Step into the Cryogenic 3D Packaging Lead for Quantum Modules role at Jobtailor in Greater London, England, United Kingdom and grow with us.
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