Principal Embedded Software Engineer

Talent Edge Technology are looking to hire a Senior Embedded Engineering Leader to take ownership of the firmware stack for a next-generation, AI-enhanced connected music hardware platform.

This role is hands‑on and deeply technical, suited to an engineer who enjoys working across the full embedded stack, from low-level hardware bring‑up through to cloud‑connected features and who places a premium on robustness and real‑world reliability.

• Ownership and evolution of the embedded firmware stack for connected consumer hardware
• Design and implementation of critical systems, including Over-the-air update infrastructure, Bluetooth audio (A2DP / AVRCP), Wi‑Fi connectivity and device provisioning, Bootloaders and persistent state management, Audio DSP integration
• Ensuring production‑grade stability, performance, and fault tolerance
• Close collaboration with mobile, web, backend, and hardware teams to deliver cohesive end‑to‑end experiences
• Supporting device certification and production readiness, including FCC / CE compliance
• Providing technical leadership, architectural direction, and high‑quality code review within the embedded domain

• Senior‑level embedded firmware experience, ideally in consumer electronics (Audio would be even better)
• Strong C & C++ skills on resource‑constrained systems
• Experience with FreeRTOS or comparable RTOS environments
• Hands‑on work with Bluetooth and Wi‑Fi stacks
• Familiarity with embedded build systems such as CMake
• A strong engineering mindset around reliability, resilience, and real‑world failure modes
• Audio, DSP, or media‑related systems is HUGELY desirable
• Shipping hardware products at scale
• OTA update systems and secure firmware pipelines
• Certification processes (FCC, CE, or similar)

You’ll be joining a small, senior team operating at the intersection of hardware, software, music, and AI
, with a proven track record of shipping devices at scale and a significant installed user base.

The company is emerging from a period of stability, but with major next‑generation products planned for 2026, and this role will be central to shaping the technical direction and execution of those devices.