ASIC Package Engineer Intern: Design, Yield & Impact
Listed on 2026-11-04
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Engineering
Packaging Engineer, Electronics Engineer, Engineering Design & Technologists, Process Engineer
Advanced Micro Devices, Inc. (AMD) seeks a highly motivated ASIC Package Engineering intern/co-op to join the packaging team. You will work with engineers to bring advanced packaging tech to reality, supporting design and development of substrates, interposers, and bumps for AMD products.
The role involves learning package design, verification, and material benchmarking, with emphasis on yield improvement and cost efficiency during the internship or co-op term.
The ASIC Package Engineer Intern:
Design, Yield & Impact role at Advanced Micro Devices, Inc. is now open for applications in Longmont, CO, United States.
We invite applications for the ASIC Package Engineer Intern:
Design, Yield & Impact position located in Longmont, CO, United States.
The following opportunity is for a ASIC Package Engineer Intern:
Design, Yield & Impact with Advanced Micro Devices, Inc.
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