Modular AI Internship; Summer Housing
Listed on 2026-10-15
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Software Development
AI Engineer (Applied/Software), Software & AI Developer Internship
Qualcomm Technologies, Inc. invites applications for its Modular Engineering Internship to work on next‑generation AI infrastructure and software. Interns will be aligned to projects in AI inference, compilers, GPU kernels, distributed systems, and developer tooling, under mentor guidance.
The program runs 11–14 weeks in Summer 2027, with opportunities across multiple modules. Includes relocation coverage and furnished housing for the internship period.
The following position is for a Modular AI Internship (Summer 2027) — Relocation & Housing with QUALCOMM, Inc.
We would love to welcome a new Modular AI Internship (Summer 2027) — Relocation & Housing to our group in Los Altos, CA, United States.
For the Modular AI Internship (Summer 2027) — Relocation & Housing position at QUALCOMM, Inc., we are reviewing applications now.
Step into the Modular AI Internship (Summer 2027) — Relocation & Housing role at QUALCOMM, Inc. in Los Altos, CA, United States and grow with us.
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