IC Package Design Engineer

Join Apple's Packaging team as a Package Design Engineer, where you will define, design, and integrate advanced electronic packaging solutions for products like iPhone, iPad, Mac, Apple Watch, and Apple TV. This role focuses on driving the physical design and integration of semiconductor packages across various technologies, shaping the architecture and efficiency of next-generation products while leveraging automation and AI.

Responsibilities:

• Lead advanced package architecture and optimization of package structures.
• Own the physical design of Package/SiP/module from concept through tape-out.
• Perform physical layout of package substrates for diverse silicon technologies including SoC, Memory, RF, and cellular ICs.
• Execute parasitic extraction and S-parameter modeling to ensure SI/PI performance targets are met.
• Collaborate with cross-functional teams on package feasibility and system co-optimization, aligning with Product Design and Silicon/SIPI teams.
• Drive improvements in package design methodology by evaluating new CAD tools and developing automated design and verification flows.

Qualifications:

• Bachelor's degree required.
• Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms.
• Strong understanding of high-speed interface layout constraints and SI/PI analysis, with experience in simulation tools like HFSS or PowerSI.
• Solid grasp of substrate manufacturing processes, design rules, and design for manufacturability.
• Familiarity with Unix/Linux environments and proficiency in scripting languages such as Python, Perl, or TCL.