Hybridization Engineer - FPA & Flip-Chip Lead
Listed on 2026-10-18
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Engineering
Process Engineer, Mechanical Engineer, Manufacturing Engineer, Systems Engineer
A hybridization Mechanical Engineer is sought by a well-funded deeptech startup in California focused on semiconductor innovations. This hands-on role involves supporting manufacturing activities for infrared and visible focal plane array (FPA) assemblies, optimizing production processes, and leading technical teams.
Ideal candidates should have a Master’s degree and a strong understanding of flip-chip bonding, along with five years of relevant experience. You will contribute to manufacturing troubleshooting and lead efforts in process control and risk management.
Step into the Hybridization Engineer - FPA & Flip-Chip Lead role at well-funded deeptech startup in California, MO, United States and grow with us.
This is a great position to take on the Hybridization Engineer - FPA & Flip-Chip Lead role at well-funded deeptech startup.
As a Hybridization Engineer - FPA & Flip-Chip Lead, you will play an important part at well-funded deeptech startup in California, MO, United States.
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