AI-Driven VLSI Packaging Design Engineer
Listed on 2026-10-18
-
Engineering
Packaging Engineer
NVIDIA’s Advanced Package Engineering team is expanding to build production‑grade EDA tooling for next‑generation AI and HPC packages. The role focuses on crafting flows for silicon and interposer design, improving automation, and enabling engineers with robust, maintainable tools.
You will work with skilled engineers to implement, test, and optimize package design workflows, leveraging Python/C++ and AI techniques to enhance design analysis and throughput. Equity and benefits are offered.
Our organisation is growing, and we are hiring a AI-Driven VLSI Packaging Design Engineer in California, MO, United States.
The AI-Driven VLSI Packaging Design Engineer position in the Engineering field is open for applications.
We have an opening for a AI-Driven VLSI Packaging Design Engineer in California, MO, United States within Engineering.
This role, AI-Driven VLSI Packaging Design Engineer at NVIDIA, could be your next career step.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).