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Senior Substrate & DIC Packaging Engineer
Job in
Los Angeles, Los Angeles County, California, 90001, USA
Listed on 2026-10-18
Listing for:
TSMC - Taiwan Semiconductor Manufacturing Company Limited
Full Time
position Listed on 2026-10-18
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer
Job Description & How to Apply Below
A leading semiconductor company is seeking a Substrate / Advanced Package Engineer to join their innovative 3
DIC design team in California. Candidates should have a Master's or Ph.D. with 15+ years of experience in advanced packaging technologies. The role involves design and simulation of complex substrate and packaging technologies, collaborating with cross-functional teams, and mentoring junior engineers. This position offers a competitive salary and benefits package.
Consider building your career as a Senior Substrate & 3
DIC Packaging Engineer at TSMC
- Taiwan Semiconductor Manufacturing Company Limited. The Senior Substrate & 3
DIC Packaging Engineer role at TSMC
- Taiwan Semiconductor Manufacturing Company Limited is now open for applications in California, MO, United States. Join us at TSMC
- Taiwan Semiconductor Manufacturing Company Limited as our next Senior Substrate & 3
DIC Packaging Engineer in California, MO, United States.
Position Requirements
10+ Years
work experience
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