Principal Thermal Engineer

Xscape Photonics is a cutting-edge technology company developing advanced photonic systems for high-

performance computing and communication applications. Our work focuses on enabling next-generation

optical interconnects through innovative integration of photonics, electronics, and packaging technologies.

We are building highly efficient, scalable solutions where thermal management plays a critical role in

performance, reliability, and product success.

We are seeking a Staff or Principal Thermal Engineer to own thermal architecture, performance, and

strategy for our photonic and electronic systems — from early concept through production. This is a high-

ownership role: you will set the thermal design direction across programs, own module thermal

performance against target temperature and crosstalk limits, lead the development of cooling solutions

(TECs, TIMs, heat spreaders/heat sinks, air and liquid cooling), drive simulation and validation

methodology, and own thermal-related failure analysis. You will represent thermal engineering in

customer- and leadership-facing technical reviews, work closely with optical, mechanical, electrical,

packaging, firmware, and reliability engineers, and mentor and guide other thermal engineers as the team

• Own thermal architecture and strategy for photonic modules and systems across multiple programs, from concept through production
• Lead design and development of cooling solutions using:
  • Thermoelectric coolers (TECs)
  • Thermal interface materials (TIMs)
  • Heat spreaders and heat sinks
  • Air cooling and liquid cooling approaches
• Perform thermal trade-off analysis across candidate designs, evaluating cost, power consumption, and mechanical and electrical complexity to guide architecture decisions
• Lead critical cooling-technology, material, and supplier decisions (TECs, TIMs, cooling solutions), balancing product performance, cost structure, and long-term scalability
• Set thermal simulation methodology and standards; drive CFD analysis strategy (temperature distribution, heat flow, thermal crosstalk) and review the work of other engineers
• Define and own the thermal test and validation strategy, including instrumentation (thermocouples, IR imaging, DAQ/LabVIEW) and test-to-simulation correlation

• Own thermal-related failure analysis, working closely with the Lead FA Engineer on the overall FA process
• Diagnose thermal-stack failure modes such as TIM pump-out and dry-out, solder void growth, bond-line degradation, TEC fatigue over thermal cycling, and warpage-driven loss of contact
• Apply thermal FA diagnostic techniques — IR/lock-in thermography for hot-spot localization, thermal transient testing and structure-function analysis, and coordination of CT/acoustic
• Feed FA findings back into design margin, TIM/material selection, and thermal qualification criteria to prevent recurrence

• Own accountability for module thermal performance against targets — define the thermal budget, junction and case temperature limits, TEC/laser operating windows, and allowable thermal crosstalk, and hold the design to them from prototype through production and across the product's operating life
• Own thermal integrity of the system, including thermal runaway prevention, heat-path optimization, and definition and enforcement of worst-case operating margins and guard-bands across environmental and use-case variations
• Represent thermal engineering in customer and executive/leadership reviews; present thermal compliance, risk, and trade-offs at program milestones
• Partner with mechanical, PCB, and packaging engineering to integrate thermal requirements early in design
• Support new product introduction (NPI) and transfer to…