Lead ASIC Package Design Engineer FC-BGA/MCM, Equity
Listed on 2026-11-05
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Engineering
Systems Engineer, Electronics Engineer, Hardware Engineer
K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and multi-chip module packaging strategies for high-performance SoCs, from early architecture through production ramp.
You will own end-to-end package architecture, drive SI/PI trade studies, power delivery, and thermal management, and engage OSATs and substrate vendors to ensure first-pass success for dense, high-speed ASICs. Collaboration with silicon and systems teams is essential.
For the Lead ASIC Package Design Engineer FC-BGA/MCM, Equity position at K2 Space, we are reviewing applications now.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Lead ASIC Package Design Engineer FC-BGA/MCM, Equity role in the description above.
We appreciate your interest in this position.
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