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Software & Electronics Development Engineer - ETO

Job in Louisville, Jefferson County, Kentucky, 40201, USA
Listing for: Packsize
Full Time position
Listed on 2025-12-22
Job specializations:
  • Engineering
    Systems Engineer, Electronics Engineer, Embedded Software Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Software & Electronics Development Engineer - ETO

Join to apply for the Software & Electronics Development Engineer - ETO role at Packsize

Job Description

We are Packsize. A fast-growth multinational technology company committed to eliminating excessive and unfriendly packaging experiences through the adoption of Right-sized On-Demand® packaging systems, software, and services. Founded in 2002 and headquartered in Salt Lake City, Packsize gives businesses worldwide the ability to improve their customer satisfaction and enhance brand value while gaining efficiencies and savings. We accomplish this through our shared passion for a world where every box, envelope, and package shipped is the right size.

This right‑sized shipment sends a ripple effect through the supply chain by reducing carbon emissions and fuel needs. In pursuit of packaging sustainability, we value the contribution of our combined experiences, backgrounds, and relationships to create a team where Everyone Fits. Become a part of Packsize and help us build Smart Packaging for a Healthy Planet®.

About

The Role

The Software & Electronics Development Engineer is part of the ETO Team based in Louisville, KY, focused on developing and integrating embedded systems, digital and analog electronics, and control software for Packsize packaging automation equipment. This role bridges hardware and software engineering disciplines to deliver high‑performance machine control and system connectivity solutions. You will define and deliver technologies and project deliverables for new product development and life‑cycle management initiatives.

This includes designing electronic architectures, developing embedded firmware, application software, and ensuring robust integration between electronics, mechanical systems, and user interfaces.

Education, Experience, and Skills Desired
  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field
  • 3–7 years of experience in electronics and embedded software development
  • Experience with analog/digital circuit design, PCB layout, and sensor integration
  • Proficiency in embedded programming (C/C++, real‑time operating systems, microcontrollers)
  • Familiarity with industrial communication protocols (Ether

    CAT, CAN, RS‑485, Ethernet/IP)
  • Experience developing GUI or connectivity software for machine control systems
  • Understanding of system control architectures, safety standards, and risk assessment
  • Ability to perform feasibility analyses, cost and functionality trade‑offs, and risk mitigation
  • Strong analytical, documentation, and communication skills
  • Experience working within structured product development processes
  • Comfortable collaborating with internal teams and external partners or subcontractors
What You'll Do
  • Develop electronics and software for Packsize packaging systems, including machine control, system control, and connectivity modules
  • Define and implement software and electronics architecture and design for feasibility and functional prototypes
  • Analyze and evaluate project requirements to define product specifications, design standards, and risk‑based deliverables
  • Coordinate with cross‑functional teams to ensure compliance with project plans, timelines, and budgets
  • Design, realize, and monitor progress on quality, functionality, and risk mitigation in alignment with R&D processes
  • Develop automated and manual test procedures for electronics and embedded software validation
  • Deliver design documentation and hand‑off packages to internal and external stakeholders for production and support
  • Conduct continuous risk analysis and reporting to support management decisions
  • Provide technical advice and knowledge transfer to colleagues and management regarding tools, technology, and process improvements
  • Contribute to new technology investigations and prototype development for next‑generation packaging automation systems
A Few Other Things
  • Up to 10% travel may be required for collaboration, testing, or installation support
  • Ability to perform hands‑on work with electronic assemblies and test equipment
  • Comfortable in a dynamic, collaborative R&D environment
What We Offer

A purpose‑driven environment where you can…

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