Hardened Microelectronics Science & Technology Lead

Overview

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross‑fertilization of ideas necessary for true innovation.

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Draper is seeking someone to lead our Science and Technology (S&T) efforts related to Hardened Microelectronics Engineer (HME) within our engineering organization. Reporting to the Principal Director for Science and Technology (S&T), this position will have the primary responsibility of aligning Draper's microelectronics engineering technology development efforts with corporate technology strategy as well as the strategies of individual business offices.

The Hardened Microelectronics Engineer (HME) will lead work in shaping technical strategies, integrated development plans with business offices. You will support the shaping, pursuit, and capture of external programs within the DoD S&T community (DARPA, ONR, AFRL, NRL) as well as commercial partners and help provide oversight on the execution of these S&T projects.

The Hardened Microelectronics technical scope will include advanced ASIC design, 3D/HI packaging technology, embedded cyber‑physical security, anti‑tamper, radiation hardening and design for other extreme environments, and collaboration with our fabrication teams and facilities. Are you ready for a new challenge? Apply today!

• Specify and validate IC architecture and define requirements for custom ICs, ASICs and SoC.
• Design and simulate circuits at transistor‑level to implement architecture and requirements, perform system‑level design.
• Mentor individuals, teams and offer guidance on design and implementation tasks.
• Optimize hardware designs for performance, power, and cost.
• Evaluate the hardware feasibility of complex algorithms and requirements.
• Perform verification and debugging for designs.
• Guide designs through entire product cycle.
• Document all phases of chip development.
• Independently drive solutions to complex, multidisciplinary problems with deep understanding of a customer’s strategic priorities.
• Help customers shape their needs and develop requirements for programs that solve their most challenging technical problems.
• Subject Matter Expert (SME) in Integrated Circuit architectures and designs with broad knowledge across related technical disciplines.
• Contribute to advancing State of the Art (SOA) solutions and techniques in the field.
• Support Draper strategic objectives and work with management to build capability in key areas to sustain business growth.
• Perform other duties as assigned.

• Proficiency in Integrated Circuit design, subject‑matter expert in IC design related sub‑discipline.
• Understanding of Custom IC, ASIC/SoC design, and general computer architecture.
• Ability to write detailed design specifications.
• Ability and willingness to mentor, teach and guide less experienced engineers.
• Excellent verbal and written communication skills.
• Excellent mathematical skills.
• Excellent organizational skills and attention to detail.
• Excellent time‑management skills with proven ability to meet deadlines.
• Strong analytical and problem‑solving skills.
• Ability to prioritize tasks.
• Thorough understanding of engineering theories and procedures.

Requires a bachelor’s degree in Engineering, or related field. Master’s degree preferred.

Requires 10+ years of experience in ASIC Hardware Engineering or related.

Develop and execute the engineering strategy for hardened microelectronics to closely align with the Corporate Strategy Office, Business Development Strategies, and Draper Technology Strategy. Lead the Hardened Microelectronics IR&D portfolio. Support business offices in science and technology opportunity…