Engineering Lead - AOI​/Defect Metrology

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO
9001 international quality standard and ISO
14001 environmental management standard.

MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, GaN, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia.  to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio. Engineering Group Lead - AOI/Defect Metrology

Job Description:

In
this critical role you will be responsible for leading a small engineering team
responsible for automated optical inspection and defect reduction activities within
MACOM’s internal semiconductor fab.
Responsibilities include oversight of MACOM’s overall AOI strategy, leadership
of targeted defect reduction projects, and collaboration with the fab Process
Integration team on yield improvement across all product lines. You will be
expected to clearly communicate goals, roles, responsibilities, engage and
motivate engineering talent, define and set deliverables, plan resources, and
achieve desired results. You will be expected to contribute technically,
maintain an optimistic, can-do approach, and present status to executive level
management. Excellent judgment, data savvy, and leadership are essential to
success in this role. This position has 2 to 4 direct reports.

The right candidate will:
Possess
expert knowledge of automated defect inspection tools and techniques,
particularly in the context of RF/compound semiconductor device
fabrication

Have a
proven track record of technical problem solving, including expertise with
a broad range of data analysis and structured problem solving techniquesOperate
with a quality-centric mindset, understanding how to translate customer needs
into appropriate screening approachesPossess
a working knowledge of semiconductor fabrication across many process areas
and device typesBe
able to thrive and succeed in a fast-paced, high intensity environment,
and not be hindered by ambiguity or competing priorities. This means you
are not only able to develop and drive high-level strategic initiatives,
but can also roll up your sleeves, dig in and get the job done Remain
industry informed, familiar with the latest technologies and industry
trends

Enjoy finding solutions to difficult problems

Qualifications /

Skills:

Candidate
will have a BS in Electrical Engineering, Materials Science, Physics, or
similar with a minimum of 15 years of semiconductor fab experience. Higher
level degrees may be considered in lieu of work experience.

Minimum of 8 years of experience with automated defect inspection and other relevant metrology processes. Familiarity with OnTo/Rudolph AOI equipment and software (Discover/TrueADC) is a plus but not required.

Prior
personnel management experience strongly preferred.

Due to
ITAR restrictions, must be US citizen or Permanent Resident. Evidence of problem solving and a strong work ethic in a trusted team environment

The Salary Range for this position is $97,902 - $166,698.
Actual salary offered to candidates will depend on several factors, including
but not limited to, work location, relevant candidates’…