Device Integration Intern

# Device Integration Intern Lowell, MA, United States|req
3756

Posted on: 10/13/2026

Back to SearchMACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense.  We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies.  Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success.  We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!
** Integration Engineering Intern
** We are seeking a motivated and hard-working Engineering Intern to join our Diodes Integration Engineering team. This internship provides hands-on experience in semiconductor process integration, device characterization, yield improvement, and manufacturing engineering. The intern will gain exposure to the full semiconductor fabrication flow and work with cross-functional engineering teams to solve real-world manufacturing and device performance challenges.
** During the 12-week internship, each intern will:*
* • Be assigned a well-defined engineering project with clear objectives, deliverables, and measurable success criteria.
• Gain hands-on experience in semiconductor manufacturing, device characterization, and process engineering.
• Work closely with experienced engineers and technical mentors.
• Participate in technical training and professional development activities.
• Attend intern networking and social events.
• Present project results and key learnings during the end-of-program Poster Session.
• Receive formal performance feedback and career development guidance.
** Responsibilities*
* • Analyze manufacturing, electrical test, and yield data to identify opportunities for process and device performance improvement.
• Support process integration activities across the semiconductor wafer fabrication flow.
• Investigate relationships between fabrication processes and device electrical performance.
• Support electrical characterization of diode parameters including forward voltage, leakage, breakdown voltage, resistance, and capacitance.
• Develop and execute Design of Experiments (DOE) and apply Statistical Process Control (SPC) techniques to evaluate process variation and improvements.
• Collaborate with Process, Product, Manufacturing, Reliability, Failure Analysis, Quality, and Test Engineering teams.
• Present technical findings and recommendations to engineering teams and leadership.
** Minimum Qualifications*
* • Currently pursuing a Bachelor's, Master's, or Ph.D. degree in Electrical Engineering, Materials Science and Engineering, Chemical Engineering, Physics, or a related technical discipline.
• Basic understanding of semiconductor manufacturing and device fundamentals.
• Experience with laboratory, test, or process equipment through coursework, research, or prior internships.
• Familiarity with data analysis, statistics, and…