Precision Wire Bonding Tech — Semiconductor Manufacturing
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Manufacturing / Production
Manufacturing Engineer, Quality Engineering, Manufacturing & Industrial Operations
Job Description & How to Apply Below
Microchip Technology Inc. is seeking a skilled wire bond technician to join our RF transistor packaging team.
You will set up and operate automatic and semi-automatic wire bonders, interpret technical drawings, and ensure product quality through bond testing and process optimization. The role requires 2–5 years in semiconductor manufacturing, strong manual dexterity, and the ability to work independently in a fast-paced environment.
Consider building your career as a Precision Wire Bonding Tech — Semiconductor Manufacturing at Microchip Technology Inc.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Lowell, MA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 31.000 - 48.000.
We aim to respond to suitable candidates as soon as possible.
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