Manufacturing Engineer II: DFMA & Laser Packaging
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Engineering
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Manufacturing / Production
Job Description & How to Apply Below
Leonardo DRS in Madison, WI is seeking a Manufacturing Engineer II to provide hands-on engineering support to production, focusing on semiconductor wafer and die processing, chip-on-submount assembly, and laser packaging.
Working with the Engineering team, you will translate designs into manufacturing instructions, help improve processes, and support new product introductions and process controls. A BS in engineering and 2–5 years experience are expected.
The Manufacturing Engineer II: DFMA & Laser Packaging | 9/80 position in the Engineering field is open for applications.
All applications are reviewed carefully by our team.
The position is based in Madison, WI, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 73..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Position Requirements
5+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
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