Thermal R&D Engineer

HRL Laboratories, an IBM company, pioneers the next frontiers of physical and information science. Delivering transformative technologies in automotive, aerospace and defense, HRL advances the critical missions of its customers to help them remove limitations and create competitive advantage. HRL then transitions the work back to customers – ready for real-world application. For more than 70 years, HRL’s rich portfolio of scientific discoveries and engineering innovations continues to build on each other — often in unexpected, profound and far-reaching ways.

As a private company owned by IBM, HRL prioritizes purpose over profit, significantly advancing the state of the art.

HRL Laboratories advances critical structural and functional materials and semiconductor devices that enable precision navigation, quantum technologies and extreme-environment performance. With expertise from design through deployment, we deliver scalable, high-performance solutions that transform our customers’ missions. Our work leverages digital manufacturing and scalable microfabrication techniques to meet tomorrow’s toughest challenges.

The Thermal R&D Engineer will drive innovation in advanced thermal management technologies and serve as a focal technical contributor across multidisciplinary programs. A strong heat transfer background is required. Applicable expertise may include electronics or microelectronics cooling, hypersonics, heat pipes and vapor chambers, or other thermal domains. Experience in microfabrication, microelectronics, or 3D heterogeneous integration (3

DHI) aligns especially well with our current and near term project mix. This role is ideal for someone with broad technical interests, creativity, and a passion for pushing the limits of thermal technology.

• Innovate new approaches, processes, and designs to address challenges in thermal management and push well beyond the limits of current technology
• Lead the development of novel thermal management components
• Serve as the primary thermal management focal on teams developing microelectronic, aerospace, and/or automotive systems, payloads, and/or platforms
• Collaborate closely with internal colleagues and external partners to achieve program objectives
• Plan, coordinate, and execute the design and fabrication of thermal management systems and microsystems
• Plan, coordinate, and execute thermal management test campaigns
• Communicate technical results through oral presentations, written reports, and publications
• Document inventions and support the patenting process
• Attend and present work at relevant technical conferences
• Write research proposals to support ongoing and future program needs
• Work effectively both independently and as part of a multidisciplinary team

• Ph.D. in Mechanical Engineering, Electrical Engineering, Physics, or a related discipline
• Postdoctoral experience or 1–4 years of industry or national laboratory experience is a plus.
• Detailed knowledge of heat transfer
• Experimental laboratory experience planning, conducting, and analyzing heat transfer experiments
• Experience in scientific communication through technical presentations and journal publications
• Experience with microfabrication in a cleanroom environment (e.g., advanced packaging, MEMS, microelectronics, microfluidics) highly desired
• Experience with additive manufacturing / 3D printing (design, process, and/or materials)
• Experience with Finite Element Analysis and Computational Fluid Dynamics for thermal, thermal fluid, and thermo structural modeling
• CAD experience (e.g., Solid Works or Inventor)
• Experience with MATLAB or Python

• Ability to work for extended periods while standing or sitting at a computer workstation
• Familiarity…