Lead Process Integration Engineer

Lead Process Integration Engineer

Nexperia – Manchester, England, United Kingdom

Nexperia is a world‑class company in semiconductor development and in‑house production. A proven global player with an entrepreneurial mentality, Nexperia has a 13,000+ strong international network focused on passion, commitment and success. Built on the belief that we can overcome any challenge, we support and reward individuals equally in a dynamic, energetic environment.

Nexperia is one of the world’s leaders in essential semiconductors and aims to become a £10 billion turnover business by 2030. This ambition is driven by next‑generation technologies, continuous improvement in manufacturing sustainability, state‑of‑the‑art facilities, and, most importantly, investment in our people. We are hiring a Lead Process Integration Engineer to strengthen our Semiconductor Process Integration team in Manchester.

As a Lead Integration Engineer at Nexperia you will be at the heart of innovation, driving the successful introduction of new platforms, products, and technologies into our wafer Fab. Acting as the vital link between development, process, quality and production teams, you will ensure seamless integration of tools and processes that shape the future of semiconductor manufacturing. You will lead complex process development projects, champion root‑cause analysis, and deliver continuous improvement initiatives that enhance yield, increase throughput, reduce costs and strengthen overall process capability.

You will take products from concept to release, making a tangible impact on our operations and the global semiconductor industry.

• Project leadership – coordinate and drive process development projects to support new platforms and product introductions.
• Continuous improvement – deliver technical improvement projects aimed at enhancing yield, ease of manufacture, cost efficiency and throughput.
• Root‑cause analysis – investigate and resolve complex manufacturing issues, ensuring long‑term solutions are implemented.
• Technology introduction – support the Fab in adopting new technologies and tools, working closely with purchasing and equipment teams.
• Quality & FMEA – own FMEA updates, 8D problem‑solving and support wafer/customer complaint resolution.
• Documentation & training – generate operator instructions for new tools and train manufacturing teams on new processes.
• Mentoring – guide and develop junior engineers within the Technology Area.
• Audit support – ensure compliance with departmental procedures and support internal and external audits.

• Degree in a relevant discipline such as Electrical, Mechanical, Chemical, Industrial, Manufacturing or Production Engineering (or related).
• 5+ years’ experience in semiconductor or a relevant high‑tech industry.
• Proven track record in technical improvement projects.
• Six Sigma Green/Black Belt qualification (or equivalent).
• Strong knowledge of semiconductor device structures, physics or process flows.
• Process and equipment expertise in wafer fabrication.
• Excellent stakeholder management, communication and teamwork skills.
• Leadership and mentoring ability, with adaptability in high‑pressure environments.

Starting base salary of £50 000–£55 000 plus a bonus scheme of up to 6 %, an excellent contributory pension scheme of up to 9 %, recognition rewards scheme, EV salary sacrifice scheme, income protection and 12 × salary life assurance.

33 days of annual leave, flexible benefits scheme, enhanced parental leave, on‑site medical centre, enhanced sick pay, subsidised canteen, employee assistance programme, retail and entertainment reductions, and a variety of sports and social clubs.

Opportunity to complete leadership and management qualifications, funded academic support up to PhD level, employee goal‑setting and development plans, huge growth potential both internally and globally within the business, with both management and technical pathways.

A global commitment to becoming carbon neutral by 2035, working with suppliers who…