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Senior Packaging Design Engineer: -Gen Microelectronics

Job in Manchester, Greater Manchester, M9, England, UK
Listing for: FHLB Des Moines
Full Time position
Listed on 2026-02-16
Job specializations:
  • Engineering
    Electronics Engineer
Job Description & How to Apply Below
Position: Senior Packaging Design Engineer: Next-Gen Microelectronics
A leading semiconductor company in the United Kingdom is seeking a Senior Packaging Design Engineer. In this role, you will research and develop new packaging concepts for advanced microelectronic modules. You will collaborate with an R&D team to innovate and enhance semiconductor solutions. Candidates should have a degree in engineering and a minimum of 3 years’ experience in a related field.

Strong problem-solving and communication skills are essential to succeed in this position. The company offers a supportive culture and opportunities for growth.
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Position Requirements
10+ Years work experience
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