Lead Semiconductor Packaging Engineer
Listed on 2026-10-10
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Engineering
Packaging Engineer, Electrical Engineering, Process Engineer, Systems Engineer
Nexperia in the United Kingdom is seeking a Principal Package Competence Engineer to drive advanced packaging for Power MOSFETs. You will lead design studies and serve as a recognised expert, shaping technology roadmaps and collaborating with product lines, assembly sites and R&D teams.
The role demands a PhD with 5+ years in packaging, plus experience in DOE, simulation, and failure analysis, with a proven record of innovation. Hybrid work, competitive pay, and global impact await.
For the Lead Semiconductor Packaging Engineer position at Nexperia, we are reviewing applications now.
As a Lead Semiconductor Packaging Engineer, you will play an important part at Nexperia in Manchester, England, United Kingdom.
We invite applications for the Lead Semiconductor Packaging Engineer position located in Manchester, England, United Kingdom.
The following opening is for a Lead Semiconductor Packaging Engineer with Nexperia.
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