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Thermal Engineer –Liquid Cooling

Job in Markham, Ontario, I3P, Canada
Listing for: Amphenol ICC
Full Time position
Listed on 2026-06-05
Job specializations:
  • Engineering
    Systems Engineer, Mechanical Engineer, Electrical Engineering
Job Description & How to Apply Below

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world's largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales.

We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Position:
Thermal Engineer – Liquid Cooling

Location:
Markham, ON

New Position

Position Overview

We are seeking a highly motivated and experiencedThermal Engineer – Liquid Cooling to join ourFront-End I/O Active Thermal Solutions team. This role focuses on the design, simulation, validation, and optimization ofliquid-based active cooling solutions for high-speed interconnect and front-panel I/O systems used in data center and high-performance computing environments.

The ideal candidate will work closely with customers and cross-functional engineering teams to define thermal requirements, develop robust liquid cooling architectures, perform advanced thermal simulations, and validate designs through laboratory testing. This role deliversproduction-ready thermal solutions that meet performance, reliability, and manufacturability targets.

Key Responsibilities:

Design & Development

  • Architect and developliquid-cooled cold plates for high-density front-end I/O connector and interconnect applications.
  • Design and optimizemicrochannel structures, flow paths, and cold plate geometries to maximize thermal performance while minimizing pressure drop.
  • Select and integrate materials compatible withhigh heat flux, corrosion resistance, and long-term reliability in data center environments.
  • Collaborate with connector and mechanical design teams to ensuremechanical integration, tolerance alignment, and manufacturability .

Customer Engagement

  • Work directly with customers to gatherthermal boundary conditions, system constraints, and performance requirements .
  • Translate customer needs intothermal simulation strategies, validation plans, and design trade-offs .
  • Serve as a technical interface to explain thermal concepts, design decisions, and test results.

Thermal Simulation & Analysis

  • Develop and executeCFD thermal models using tools such asANSYS Icepak, FloTHERM, or equivalent .
  • Analyze temperature distribution, heat dissipation, and fluid flow behavior in liquid cooled front-end I/O environments.
  • Performsensitivity studies and optimization analysesto ensure designs meet performance margins.

Experimental Validation

  • Partner with lab and test engineers to plan and conductthermal performance and flow validation testing .
  • Correlateexperimental data with simulation results to validate and refine models.
  • Conduct root-cause analysis and iterative design improvements to resolve thermal issues.

Optimization & Technical Reporting

  • Optimize thermal designs consideringperformance, cost, reliability, and manufacturability .
  • Prepare detailedtechnical reports and presentations summarizing simulations, test results, and design recommendations.
  • Present optimized solutions and findings to customers and internal stakeholders.

Qualifications:

Education & Experience

  • Bachelor's or Master's degree inMechanical Engineering, Thermal Engineering , or a related field.
  • Strong experience in thermal design or analysis for electronic systems, interconnects, or data center hardware.

Technical Skills

  • At least 4 years of industry experience inactive and advanced cooling technologies , including cold plates, heat exchangers, heat pipes, or vapor chambers. (Must Have)
  • Experience developingliquid cooling solutions for high-speed connectors, modules, or front-panel I/O systems. (Must Have)
  • Strong proficiency withCFD and thermal simulation tools (ANSYS Icepak, FloTHERM, or similar).(Must Have)
  • Experience withthermal instrumentation and data acquisition , including thermocouples, flow sensors, and IR imaging.
  • Experience withCAD tools such as Solid Works , Creo, or equivalent. (Must Have)
  • Solid understanding ofheat transfer, fluid dynamics, and electronic packaging .
  • Excellent written and verbal communication skills forcustomer-facing technical discussions .

Preferred Qualifications

  • Understanding ofelectrical, mechanical, and thermal trade-offs in system-level integration.
  • Experience withDesign of Experiments (DOE) or statistical optimization methods.
  • Strong analytical, problem-solving, and troubleshooting skills.
  • Ability to manage multiple projects in a fast-paced development environment.

Why Work for Us?

  • Benefits Coverage :
    Comprehensive health, dental, vision, and travel insurance.
  • Health Care Spending Account :
    Additional financial support for health-related…
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