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Job Description & How to Apply Below
In this pivotal role, you will lead cross-functional teams to execute complex packaging designs for AMD’s next-generation products. Your leadership will guide the design execution, ensuring high-quality delivery under pressure. With a focus on operational excellence, you will leverage automation and AI methodologies to enhance productivity.
Key Responsibilities:
• Lead execution of Data Center GPU/MI package design programs
• Manage competing priorities in fast-paced environments
• Establish execution frameworks with milestone tracking
• Ensure robust communication with senior leadership
• Mentor and develop a high-performing design team
Requirements:
• Experience in semiconductor package design for high-performance products
• Proven track record in leading complex projects
• Strong knowledge of package layout and multi-die integration
• Familiarity with AI/ML applications in engineering
• Excellent leadership and stakeholder management skills
Your expertise in packaging engineering will drive the development of leading-edge solutions at AMD.
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