Senior Product Development Engineer – Liquid Cooling

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales.

We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Amphenol's High Speed IO Connectors and Over Pass Solutions Business Unit is a market leader in high-speed, high-bandwidth interconnect solutions used in servers, storage, networking equipment, and data center infrastructure. Our products enable reliable, low-loss data transmission in some of the world's most advanced IT and Datacom platforms, helping power the technology behind leading Tier 1 OEMs. With global design, sales, and manufacturing teams, we are growing quickly and continuing to invest in our people and products.

This role is a chance to make a real impact as part of a collaborative, fast-moving team within Amphenol's decentralized culture, where ideas are heard, initiative is encouraged, and teams are empowered to make decisions with clear accountability.

Amphenol is seeking a highly skilled and motivated Product Development Engineer to lead the design and development ofliquid cooling solutionsforfront-end I/O connectors that will power the next generation of Artificial Intelligence (AI) and Machine Learning (ML) platforms. This role is critical to advancing thermal management technologies that support high-performance computing environments.

• Architect and develop liquid cooling plates optimized for high-density front-end I/O connector applications.
• Engineer microchannel structures,cold plate geometries, andflow path configurations to maximize thermal efficiency and minimize pressure drop.
• Select and integrate materials compatible with high-performance thermal transfer and long-term reliability in data center environments.
• Collaborate with connector design teams to ensure seamless mechanical integration and manufacturability.

• Define and execute thermal performance testing, including heat dissipation, flow rate analysis, and environmental stress testing.
• Validate cooling plate designs against industry standards and customer-specific requirements.
• Work with internal labs and external partners to ensure robust qualification and certification processes.

• Lead cross-functional development projects from concept through production.
• Manage timelines, deliverables, and resource coordination to meet program milestones.
• Track and report progress using structured project management tools and methodologies.

• Serve as a technical liaison with key customers to understand requirements and deliver exceptional support.
• Represent Amphenol's commitment to exceptional customer experience through proactive communication, technical presentations, and issue resolution.

• Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or related field.
• 5+ years of experience in product development, preferably in thermal management or connector technologies.
• Strong proficiency in CAD tools (e.g., Solid Works,…