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Hardware Engineer

Job in Markham, Ontario, I3P, Canada
Listing for: NUVACORE
Full Time position
Listed on 2026-10-24
Job specializations:
  • Engineering
    Hardware Engineer, Systems Engineer, Electronics Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 110000 - 170000 CAD Yearly CAD 110000.00 170000.00 YEAR
Job Description & How to Apply Below

Nuvacore is building a ground-up high performance, low-power CPU for next-generation compute workloads. We are seeking a highly skilled and motivated Hardware Board Design Engineer to drive the architecture, design, and development of next-generation, high-performance, and energy-efficient CPU server solutions for data center applications. In this role, you will be responsible for the end-to-end hardware development life cycle, from initial concept and feasibility studies to schematic capture, PCB layout oversight, component selection, and laboratory brings-up.

You will collaborate closely with cross-functional teams—including Package Design, Signal/Power Integrity (SI/PI), Thermal/Mechanical Engineering, and Software/Firmware—to deliver robust, scalable, and cutting-edge system platform hardware.

ROLE
  • Board-Level Architecture & Design:
    Lead the design and development of complex, multi-layer, high-density interconnect (HDI) server motherboards, baseboards, and riser cards optimized for data center workloads
  • Schematic Capture & Component Selection:
    Ownership of schematic entry, creation of complex hierarchical designs, and rigorous component selection prioritizing power efficiency, thermal performance, and long-term reliability
  • Layout

    Collaboration:

    Work hand-in-hand with PCB layout engineers to define board stack-ups, routing constraints, component placement, and shielding strategies
  • Cross-Functional Alignment:
    Collaborate tightly with the Silicon, Package Design, and SI/PI teams to implement optimal co-design methodologies for high-speed interfaces (e.g., PCIe Gen6/Gen7, DDR5/LPDDR6, CXL) and robust power delivery networks (PDN)
  • Power & Thermal Management:
    Design highly efficient, high-current power delivery paths (VRMs, multiphase buck converters) capable of supporting ultra-high-power CPUs while meeting strict data center energy-efficiency metrics
  • Bring-up, Validation, & Debug:
    Lead the hands-on hardware bring-up, debugging, and validation of prototype boards in the lab using high-speed oscilloscopes, logic analyzers, and specialized test equipment
  • Manufacturing Support:
    Generate comprehensive fabrication and assembly documentation (Gerbers, BOMs, ODB++). Partner with fabrication houses and EMS partners to resolve DFM/DFA/DFT issues and ensure smooth mass production transitions
Requirements — Must Have
  • Education:

    Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field
  • Experience:

    5+ years of professional experience in high-speed hardware board design, ideally focused on enterprise servers, data center hardware, or complex computing platforms
  • EDA Tools:
    High proficiency in industry-standard schematic capture and PCB layout tools (e.g., Cadence Allegro, Concept HDL, OrCAD, or Altium Designer)
  • High-Speed Design Knowledge:
    Direct experience designing with high-speed serial/parallel interfaces (such as PCIe, DDR/LPDDR, or USB) and understanding basic SI/PI constraints
  • Power Delivery:
    Proven experience with board-level power distribution design, DC-DC converters, and multi-phase VRMs supporting high-current rails
  • Lab

    Skills:

    Strong hands-on laboratory experience with hardware debugging, rework, and using diagnostic equipment (DMMs, scopes, network analyzers)
Requirements — Nice To Have
  • Education:

    Master’s degree in Electrical Engineering or Computer Engineering
  • Advanced Data Center

    Experience:

    10+ years deep understanding of data center server architectures, OCP (Open Compute Project) standards, and system topologies (e.g., CPU sockets, high-speed riser configurations, and BMC sub-systems)
  • Silicon-Package-Board Co-Design:
    Familiarity with the interplay between advanced semiconductor packaging (e.g., chiplets, 2.5D bridges) and high-density PCB implementation
  • Simulation &…
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