ASIC Physical Design Engineering Intern

ASIC physical design and scripting define this Qualcomm internship in Markham, Canada, supporting synthesis analysis and backend flow work.
As an Intern on Qualcomm’s QDSP team, you will contribute to ASIC physical design implementation tasks. You will work with current ASIC technologies, EDA tools, and flow methodology development. TCL, Perl, and Python scripting support these engineering activities.

Key Responsibilities:

Analyze synthesis and backend flows for ASIC implementation
Support physical design implementation related tasks
Develop flow methodologies using scripting languages
Work with current ASIC technologies and EDA tools
Contribute to Qualcomm QDSP team engineering activities
Requirements:
Study toward a bachelor’s or master’s degree
Electrical Engineering, Computer Engineering, or related field

Experience with TCL, Perl, and Python
VLSI academic or project experience is desirable
At least one year programming experience academically
Build ASIC physical design experience with Qualcomm through synthesis analysis, backend flows, EDA tools, and scripting.