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Laser Reliability Engineer

Job in Marlborough, Middlesex County, Massachusetts, 01752, USA
Listing for: The Ascent Group, LLC
Full Time position
Listed on 2026-09-15
Job specializations:
  • Engineering
    Quality Engineering, Electrical Engineering, Test Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 180000 USD Yearly USD 120000.00 180000.00 YEAR
Job Description & How to Apply Below

Lead Laser Component Reliability Engineer

We are seeking a Lead Laser Component Reliability Engineer to support reliability analysis and qualification activities for semiconductor laser diodes and fiber-coupled laser modules. This role will focus on accelerated life testing, degradation analysis, statistical lifetime modeling, and reliability risk assessment.

Key Responsibilities
  • Develop and execute reliability test plans for laser and optoelectronic components.
  • Conduct accelerated life, burn-in, stress, and qualification testing.
  • Analyze reliability data using statistical methods to evaluate lifetime, degradation, and failure rates.
  • Investigate failure mechanisms and perform root-cause analysis.
  • Prepare technical reports and provide data-driven recommendations.
  • Collaborate with cross-functional teams to support product qualification and reliability improvements.
Required Qualifications
  • Bachelor's degree with 5+ years of experience, or Master's degree with 3+ years of experience, or PhD with 3+ years of industry experience in Reliability Engineering, Electrical Engineering, Physics, Materials Science, or a related field.
  • Experience in reliability engineering for optoelectronic, semiconductor, photonic, or laser-based products.
  • Strong knowledge of reliability statistics, including Weibull analysis, lifetime modeling, and design of experiments (DOE).
  • Experience with accelerated life testing and degradation modeling.
  • Proficiency with data analysis tools such as Python, R, or similar statistical software.
Preferred Qualifications
  • Knowledge of optoelectronic packaging and material/interface reliability.
  • Experience with failure analysis techniques such as SEM, FIB, EDX, and microscopy.
  • Strong communication and cross-functional collaboration skills.
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