Senior Scientist, Advanced Packaging

We are seeking a highly motivated, innovative, and hands-on Senior R&D Scientist to lead the development of next-generation copper electroplating solutions for dual damascene interconnect applications
. This role will focus on designing, formulating, and scaling advanced Cu plating chemistries and processes that enable future semiconductor technology nodes with improved feature filling performance, reliability, and manufacturing productivity. Success in this role requires strong experimental skills, effective cross-functional collaboration, and the ability to creatively solve complex technical problems in situations where established solutions may not exist.

The successful candidate will work at the intersection of electrochemistry, materials science, semiconductor process integration, and customer collaboration to create innovative products for leading-edge memory

manufacturers.

• Lead research and development of advanced copper electroplating chemistries for dual damascene semiconductor interconnect fabrication.
• Design and execute experiments to optimize Cu fill performance in high aspect ratio trenches and vias.
• Partner with Material Innovation team to develop novel additive systems including suppressors, accelerators, levelers, and related formulation components.
• Investigate plating mechanisms using electrochemical, analytical, and materials characterization techniques.
• Collaborate with process integration, analytical, engineering, and manufacturing teams to accelerate technology development.
• Support scale-up activities from laboratory development through pilot manufacturing and customer qualification.
• Work directly with leading semiconductor customers to understand technology challenges and translate requirements into product roadmaps.
• Drive technical programs through collaboration with global teams, including scientists and engineers, customer-facing account teams, and external partners.
• Drive intellectual property generation through invention disclosures, patents, and technical publications.
• Present technical results to customers, senior management, and industry conferences.
• Monitor industry trends in advanced semiconductor metallization, interconnect scaling, and next-generation packaging technologies.

• Ph.D. in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or a related technical discipline.
• Strong understanding of electrochemistry and metal electrode position principles.
• Experience designing and analyzing statistically driven experiments.
• Proven record of technical innovation and problem solving.
• Excellent communication and presentation skills.
• Ability to work effectively in a multidisciplinary and customer-facing environment.

• Direct experience with electroplating for semiconductor applications.
• Knowledge of dual damascene integration and BEOL metallization processes.
• Familiarity with electrochemical methods including cyclic voltammetry, EIS, chronoamperometry, and chronopotentiometry at a rotating disk electrode.
• Understanding of reliability challenges including electromigration, stress migration, and void formation.
• Experience transferring R&D technologies into manufacturing environments.
• Track record of patents, technical publications, and customer-facing technology development.