FPA Assembly and Technician Security Clearance

Position: FPA Assembly and Technician with Security Clearance
L3

Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers' mission and quest for professional growth. L3

Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do. L3

Harris Technologies is the Trusted Disruptor in the defense industry. With customers' mission-critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security.

Job Title:

Manufacturing Tech B Job Code: 32678

Job Location:

Mason, Ohio

Schedule:

(9/80R , 1st Shift) About L3

Harris Technologies: L3

Harris Technologies is an agile global aerospace and defense technology innovator, delivering end-to-end solutions that meet customers' mission-critical needs. The company provides advanced defense and commercial technologies across space, air, land, sea and cyber domains. L3

Harris has approximately $18 billion in annual revenue and 47,000 employees, with customers in more than 100 countries.

Job Description:

As a Manufacturing Technician you will be responsible for processing and testing production of parts, components, subassemblies, and final assemblies. The ideal candidate will have experience as a skilled technician with exceptional ability for handling delicate semiconductor products on the process line. Those parts include high value wafers up to 200mm diameter and discrete semiconductor die for assembly and test into FPAs.

Essential Functions:

• Set up and operate semiconductor processing / testing equipment.
• Perform manual and automated processes on high value, delicate wafer and discrete die / FPA products.
• Carefully handle and transport high value, delicate wafer and discrete die / FPA products.
• Inspect and measure semiconductor wafers and discrete die / FPAs with precision measuring equipment such as measuring microscopes, thickness measurement tools, flatness tools, and scanning electron microscopes.
• Process products with solvents, acids, bases and other flammable PACs.
• Accurately record data in computers using Excel and Access and manually in logbooks.
• Perform minor cleaning and maintenance on hardware tooling and processing equipment.
• Work extended hours or flex hours to meet short term business requirements as determined by management.
• Must be able to stand and or sit for long periods of time.
• Must be able to handle delicate parts in a steady fashion.
• Must be able to wear cleanroom garments to include facemask, safety glasses, gloves, full coverall, head cover, and boots.

Qualifications:

• Requires a High School Diploma or equivalent and a minimum of 4 years of prior relevant experience or 2 years post-Secondary/Associates Degree with 0 to 2 years of prior related experience.
• A minimum of 2 years of experience in a role requiring handling small and delicate parts. Preferred Additional

Skills:

• Candidate must demonstrate high attention to detail and a willingness to learn and develop their manufacturing skills through job training.
• Candidate must have the ability to follow detailed work instructions.
• Excellent teamwork and communication skills.
• Experience using hazardous chemicals in a manufacturing environment.
• Experience working in a cleanroom environment and handling semiconductor wafers is strongly desired. L3

Harris Technologies is proud to be an Equal Opportunity Employer. L3

Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic…