Package Design Engineer

Position: Staff Package Design Engineer
Edinburgh, Scotland Global Operations – Global Operations /Full Time /Hybrid For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn.

But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career! Are you ready to make a significant impact in a fast-paced, innovative environment?

We are seeking a Staff Package Design Engineer to join our dynamic team in Edinburgh, UK. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.

Main Responsibilities Collaborate with cross-functional teams to drive package designs that meets Cirrus performance, reliability, and manufacturability requirements

Define package requirements from electrical, thermal, and mechanical point of view in close cooperation with Design and layout teams

Utilize AutoCAD, GDS tools, Siemen Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information

Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCBWork with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages

Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues

Grow and promote automation processes throughout the package design flow Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance

Close collaboration with customers to resolve various design issues between the piece part and PCB Required

Skills and Qualifications BS or above in Mechanical, Electrical, Chemical, or Materials Engineering Demonstrable experience in a packaging-related field

Experienced Cadence SiP layout user Strong AutoCAD user Knowledge of packaging technologies, materials, package substrate design and assembly rules

Understanding of electrical simulation results on a package design

Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations

Strong written and verbal communication skills; able to review technical ideas with customers and high-level management

Self-starter with a strong sense of ownership and accountability for driving projects to completion

Ability to build strong, influential relationships in a collaborative environment within a diverse setting

Preferred

Skills and Qualifications Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge

Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources

Electrical simulation skills

Experience using Siemens Fast 3DExperience using Siemens Calibre DRVThis…