ASIC Package Design Engineer Si, Pi

Base pay range

$/yr - $/yr

Socionext Inc. (SNI) is an innovative enterprise that designs, develops, and delivers System‑on‑Chip solutions to customers worldwide. The company focuses on AR/VR, ADAS, imaging, networking, data storage, and other dynamic technologies that drive today’s leading‑edge applications. Founded in 2015, Socionext Inc. is headquartered in Yokohama, with offices in Japan, Asia, the United States, and Europe to lead its product development and sales activities.

Location:

Milpitas, CA (office‑based)

• Provide support, expertise, and insight to the Silicon device development team through preliminary activities of package selection, routing techniques, and necessary simulation work.
• Evaluate new packaging technology and recommend packages for custom devices.
• Support substrate design and device/package qualification.
• Extract and simulate package designs for SI and PI using tools such as HFSS, POWER SI, and other leading tools.
• Collaborate closely with Package/Manufacturing teams in Japan, Marketing and Engineering teams in Santa Clara, and sales processes.

• Bachelor’s degree in Electrical Engineering or another semiconductor packaging related discipline.

• 8 to 10 years of experience in semiconductor packaging design and simulations.
• Strong record of success in a cross‑functional team environment.
• Good experience with SI/PI tools for package level extraction/simulation.
• Ability to work with Package Layout engineers.
• Strong presentation and communication skills.

• Good knowledge of IC package materials and manufacturing.

Mid-Senior level

Full‑time

Engineering, Design, and Other

Industries:
Semiconductor Manufacturing

• Medical insurance
• Vision insurance
• 401(k)
• Disability insurance
• Tuition assistance

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