Director, Product Line Manager - Advanced Packaging & Metrology; E

Company Overview

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice‑controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays.

The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem‑solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling really hard problems.

There is never a dull moment with us.

The Product Line Manager (PLM) Director for Advanced Packaging & Metrology will drive product strategy, lifecycle management, and market analysis for next‑generation semiconductor packaging and metrology solutions. This hybrid role blends technical depth with market insight, requiring leadership in both product management and strategic marketing and will be responsible for defining product strategy, driving customer adoption, and managing the full lifecycle of Advanced Packaging products.

The ideal candidate will have extensive experience in advanced packaging, metrology, or inspection technologies, and a proven ability to lead and build cross‑functional teams to deliver innovative solutions that meet evolving customer needs.

• Define and own the product roadmap, including technical direction, feature prioritization, and strategic decisions on architecture and specifications.
• Manage the full product lifecycle from concept through end‑of‑life, ensuring alignment with division goals and objectives.
• Oversee project planning, scope, schedule, budget, and resource allocation.
• Own the product line’s P&L, including revenue, margin, and cost structure.
• Drive Balanced Scorecard metrics: cost, growth, customer satisfaction, and innovation.
• Analyze market trends and technology inflections (e.g., 2.5D/3D integration, hybrid bonding, backside power delivery, chiplet architectures, fan‑out packaging, co‑packaged optics).
• Conduct strategic market studies and competitive analysis to guide investment decisions and identify growth opportunities.
• Evaluate and prioritize customer feature requests; translate market needs into actionable development plans.
• Assess emerging technologies and forecast their growth potential.

• Build and maintain strong relationships with customers, understanding their requirements and expectations.
• Drive product adoption and penetration in advanced packaging and metrology segments.
• Lead customer engagement strategies through Field Marketing and Applications Engineering.
• Act as the primary point of contact between customers and the division, supporting pre‑sales and after‑sales projects.

• Collaborate with R&D, Engineering, Sales, Marketing, Operations, and global teams to ensure successful product execution.
• Facilitate clear communication among project teams, stakeholders, and senior management, providing regular updates on status, risks, and mitigation plans.
• Champion product vision internally and externally.
• Engage with a global installed base, requiring approximately 30–40% business travel (domestic and international), based on business needs.

• Bachelor’s, Master’s, or PhD in Engineering, Physics, Materials Science, or related technical field.
• 10+ years of experience in product management, applications engineering, or technical marketing, preferably in the semiconductor or advanced packaging/metrology industry.
• Deep understanding of advanced packaging manufacturing processes and equipment (including…