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Director of Systems Engineering

Job in Milpitas, Santa Clara County, California, 95035, USA
Listing for: Analog Devices
Full Time position
Listed on 2026-10-09
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering
Job Description & How to Apply Below
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers.

With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at  and on Linked In and X.Director of Systems Engineering Position Summary We are seeking a Director of Systems Engineering to lead a multidisciplinary organization responsible for the architecture, development, and delivery of next-generation power conversion solutions. This leader will provide strategic technical direction across systems, firmware, package engineering, and magnetics while building a high-performing engineering organization and influencing product roadmaps across Analog Devices.

Key Responsibilities Team Leadership Manage, mentor, and grow a small team of engineers spanning Systems, Firmware, Packaging, and Magnetics disciplines

Set individual and team goals aligned with product roadmaps; conduct regular performance reviews and career development planning

Recruit and onboard new team members as the team scales

Foster cross-functional collaboration between disciplines that historically operate in silos

Technical Direction Guide DC/DC converter architecture definition, including topology selection, power stage design, and control loop analysis/compensation

Oversee firmware requirements and architecture for digital control, telemetry, and system-level communication (e.g., PMBus)
Direct package engineering efforts for power packages, balancing thermal, electrical, and manufacturability constraints

Guide magnetics selection and co-design (inductor/transformer) to meet efficiency, size, and EMI targets

Review and approve key technical deliverables: architecture documents, control loop stability analyses, package floor plans, magnetics specifications

Program & Cross-Functional Execution Partner with Product Marketing, Design, Test, and Package Development teams to define product requirements and specifications

Own technical risk identification and mitigation planning across the team's deliverables

Drive schedule adherence for architecture reviews, tape-out readiness, and testchip milestones

Represent the team in program reviews, providing status, risks, and technical recommendations to senior management

Process & Quality Establish and improve design review processes across Systems, Firmware, Package, and Magnetics Ensure design decisions are well-documented and traceable (specs, simulation results, test data)
Promote reuse of proven architectures, IP blocks, and magnetics solutions across projects

Required Qualifications MS/PhD in Electrical Engineering or related field7+ years of experience in power electronics, including experience in DC/DC converter design and control loop analysis

Prior experience leading or mentoring engineers, either as a people manager or senior technical lead Working knowledge of firmware/embedded systems concepts as applied to power management (control algorithms, digital compensation, telemetry)
Familiarity with power package design considerations (thermal management, parasitic inductance, current sensing)
Familiarity with magnetics design tradeoffs (core material, saturation, winding losses, integration)
Strong communication skills; able to translate technical detail for both engineers and senior stakeholders

Preferred Qualifications Experience managing teams spanning multiple engineering disciplines

Direct hands-on experience with control loop modeling/simulation tools (e.g., SIMPLIS, MATLAB/Simulink)

Experience with power module or SiP (System-in-Package) development

Track record of taking products from architecture definition through testchip and into production

What Success Looks Like (First 6-12 Months)
Team is staffed, aligned on roles, and operating with clear technical ownership across the four disciplines

Architecture and control loop methodology for current-generation products is well understood and documented

Cross-discipline design review process is established and running

At least one testchip or product milestone is delivered on schedule with the team's technical ownership clearly demonstrated

For positions requiring access to technical data, Analog…
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