Director of Systems Engineering

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers.

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Position Summary

We are seeking a Director of Systems Engineering to lead a multidisciplinary organization responsible for the architecture, development, and delivery of next‑generation power conversion solutions. This leader will provide strategic technical direction across systems, firmware, package engineering, and magnetics while building a high‑performing engineering organization and influencing product roadmaps across Analog Devices.

• Manage, mentor, and grow a small team of engineers spanning Systems, Firmware, Packaging, and Magnetics disciplines
• Set individual and team goals aligned with product roadmaps; conduct regular performance reviews and career development planning
• Recruit and onboard new team members as the team scales
• Foster cross‑functional collaboration between disciplines that historically operate in silos

• Guide DC/DC converter architecture definition, including topology selection, power stage design, and control loop analysis/compensation
• Oversee firmware requirements and architecture for digital control, telemetry, and system‑level communication (e.g., PMBus)
• Direct package engineering efforts for power packages, balancing thermal, electrical, and manufacturability constraints
• Guide magnetics selection and co‑design (inductor/transformer) to meet efficiency, size, and EMI targets
• Review and approve key technical deliverables: architecture documents, control loop stability analyses, package floor plans, magnetics specifications

• Partner with Product Marketing, Design, Test, and Package Development teams to define product requirements and specifications
• Own technical risk identification and mitigation planning across the team's deliverables
• Drive schedule adherence for architecture reviews, tape‑out readiness, and testchip milestones
• Represent the team in program reviews, providing status, risks, and technical recommendations to senior management

• Establish and improve design review processes across Systems, Firmware, Package, and Magnetics
• Ensure design decisions are well‑documented and traceable (specs, simulation results, test data)
• Promote reuse of proven architectures, IP blocks, and magnetics solutions across projects

• MS/PhD in Electrical Engineering or related field
• 7+ years of experience in power electronics, including experience in DC/DC converter design and control loop analysis
• Prior experience leading or mentoring engineers, either as a people manager or senior technical lead
• Working knowledge of firmware/embedded systems concepts as applied to power management (control algorithms, digital compensation, telemetry)
• Familiarity with power package design considerations (thermal management, parasitic inductance, current sensing)
• Familiarity with magnetics design tradeoffs (core material, saturation, winding losses, integration)
• Strong communication skills; able to translate technical detail for both engineers and senior stakeholders

• Experience managing teams spanning multiple engineering disciplines
• Direct hands‑on experience with…