Senior Microelectronics Packaging Process Engineer
Listed on 2026-10-15
-
Engineering
Electronics Engineer, Packaging Engineer, Process Engineer, Manufacturing Engineer -
Manufacturing / Production
Electronics Engineer, Packaging Engineer, Manufacturing Engineer
Teledyne Technologies Incorporated is seeking a Senior Process Engineer in Milpitas, California to help develop manufacturing processes for high-reliability microelectronic products. You will work with cross-functional teams to take packaging and assembly from concept to production qualification.
The role requires 8+ years in microelectronic assembly, expertise in die attach, wire bonding, flip chip, and materials, plus strong communication. U.S.
We invite applications for the Senior Microelectronics Packaging Process Engineer position located in Milpitas, CA, United States.
We are looking to fill the Senior Microelectronics Packaging Process Engineer position at Teledyne Technologies Incorporated in Milpitas, CA, United States.
The Senior Microelectronics Packaging Process Engineer role at Teledyne Technologies Incorporated is now open for applications in Milpitas, CA, United States.
Join us at Teledyne Technologies Incorporated as our next Senior Microelectronics Packaging Process Engineer in Milpitas, CA, United States.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).