FIB-SEM Engineer

TITLE:

FIB/SEM ENGINEERFLSA STATUS: EXEMPT

REPORTS TO:

SR. MANAGER, WAFER CHARACTERIZATION

SUMMARY:

Under the direction of the Sr. Manager of Wafer Characterization, the FIB/SEM Engineer performs physical characterizations and materials/failure analyses of product devices using state-of-the-art analytical FIB/SEMs, prepares sophisticated TEM lamella samples, analyzes results, summarizes findings, and supports the development of new designs, processes, or materials for magnetic recording heads, MRAM, or other devices. This position is in Milpitas, California.

ESSENTIAL FUNCTIONS:

Prepares sophisticated TEM lamella samples using different FIB/SEMs to support TEM analyses

Performs device cross-section imaging and metrology through high-resolution SEM/STEM imaging

Performs device failure analysis using different FIB/SEMs attached with EDSPerforms device structure analysis using FIB/SEM 3D tomography

Actively participate in developing new recipes to improve the consistency and efficiency of sample preparation.

Works with other team members to develop new techniques for sophisticated metrology and device/material failure analysis

Proactively responds to issues related to materials quality or the characterization process and initiates resolution

Reviews and analyzes data, creates reports, and presents findings to panels, groups, teams, or departments as required

Interacts and responds to inquiries from other product groups regarding process-related issues and product or device requirements

Adheres to all safety policies and procedures as required

Performs other duties of a similar nature or level

* MINIMUM QUALIFICATIONS:

Master’s degree in Materials Science, Chemical Engineering, or Physics and/or equivalent relevant experience; alternate qualifications Bachelor's degree in Materials Science, Chemical Engineering, or Physics with three years of experience

Strong knowledge of TEM lamella sample preparation and in-depth understanding of FIB/SEM instrument fundamentals

Strong interest in metrological, materials and failure analyses for the advancement of magnetic recording technology using knowledge and skills of different materials analysis techniques.

Proficient in the use of Microsoft Office Applications Knowledge, Skills, and Abilities:

Proficient in the fundamental understandings of FIB/SEM, EDS, EBSD, and 3D tomography

Knowledge and ability to prepare TEM lamella samples, design and conduct experiments, interpret complex data, and recommend correction action

Fundamental understanding or hands-on experience in TEM, STEM, EDS, and EELS is a plus Knowledge of semiconductor or basic HDD industry principles, practices, and techniques

Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations

Able to independently create reports, presentations, and written analysis summaries

Strong ability to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management

Demonstrated ability to understand and carryout complex instructions given verbally or in writing

Able to work productively and collaboratively with all levels of employees and management

Able to comply with all safety policies and procedures

Demonstrated organizational and time management skills

Demonstrated problem-solving and trouble shooting skills

Flexible and able to prioritize

The annual base salary for this full-time position is between $- + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

T…