Dry Etch Manufacturing Engineer

TITLE:

DRY ETCH MANUFACTURING ENGINEERFLSA STATUS: EXEMPT

REPORTS TO:

SR. MANAGER, DRY ETCH MANUFACTURING ENGINEERING

SUMMARY:

Under the direction of the Sr. Manager Dry Etch Manufacturing Engineering, the Dry Etch Manufacturing Engineer is responsible for the developing and implementing new dry etch processes (RIE, IBE, ashing, etc.) for next generation magnetic recording heads, including designing and conducting wafer experiments, analyzing the data, and reporting the results; developing and implementing practices or methodologies which reduce cost and improve operational efficiency;

conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

Develops and implements new dry/plasma etch processes (RIE, IBE, ashing, etc.), for next generation magnetic recording heads

Reviews characterization data from FIB, SEM, and TEM to conduct root cause analysis and recommend corrective action

Implements new process control schemes or methodologies which ensure product manufacturability

Develops and implements practices or methodologies which reduce cost and improve operational efficiency

Develops and implements processes or procedures for transitioning new products into the production line Reviews, updates, and maintains documentation and process instructions

Interacts with suppliers and vendors to ensure that appropriate materials or supplies are readily available for line use Instructs operators and technicians on processes and procedures, including modifications to existing procedures

Partners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production line Designs and conducts experiments, analyzes data, and develops recommendations for improving the performance or reducing cost based on test results

Partners with other groups and departments, including process and product engineering to develop and implement new processes which reduce scrap and improve yield

Responds to inquiries from other team members, managers, or departments

Adheres to all safety policies and procedures as required

MINIMUM QUALIFICATIONS:

Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience;
Master’s degree preferred

Three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process Engineer Experience in plasma etch process development (RIE, IBE, ashing, etc.) is preferred

Experience working in a wafer fab manufacturing environment

Experience with Statistical Process Control (SPC)
Proficient in the use of Microsoft Office Applications Knowledge, Skills, and Abilities:

Knowledge of semiconductor or HDD industry principles, practices, and techniques

Knowledge of wafer fabrication processing techniques, including process development and integration practices

Knowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniques

Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure

Knowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate action

Knowledge and ability to use Microsoft Office applications to create reports and presentations

Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management

Able to work productively and collaboratively with all levels of employees and…