Technical Program​/Project Manager; Software

To make electronics, you need chips, wafers, transistors, reticles, and... To make these, you must see, test and manufacture them at scale—faster and better than ever before. That's where KLA comes in. Whether you're early in your career or an experienced professional, you'll solve complex challenges, work alongside brilliant minds and help shape the future of technology.

The Semiconductor Products and Customers (Semi PC) business unit designs, builds and sells KLA’s product portfolio to help chip manufacturers meet high-quality standards for technologies like AI, data centers, automotive and electronic devices. Our inspection, metrology, and analytics systems detect and monitor defects across logic and memory chips, specialty semiconductors, wafers, reticles, advanced packaging, process equipment and materials. We also develop technologies for specialty processes, IC substrates, and PCB manufacturing, including etch and deposition, component inspection, and imaging and analytics.

The Broadband Plasma (BBP) division is the market-leading optical inspection system used by logic, foundry, and memory customers to detect critical defects at advanced nodes. These tools combine broadband plasma technology with unmatched sensitivity and speed to support high-volume manufacturing.

In this role, you will play a key part in advancing business priorities by delivering high-impact work across your area of expertise.

The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for innovative IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes.

BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.

You will be a key member of our highly integrated multi-disciplinary team of software, systems, applications and algorithm engineers.

Key requirements:

• Program Leadership:
  Drive development of software for wafer inspection systems, coordinating across software, systems, algorithms, and applications teams.
• Product Integration:
  Collaborate with hardware and firmware teams to ensure seamless integration of software features into capital equipment platforms.
• Customer Engagement:
  Interface with Marketing and global customers to gather requirements, validate solutions, and support field deployment.
• Risk Management:
  
  Identify technical, schedule, and operational risks, implement mitigation strategies, and ensure alignment with business goals.
• Cross-Functional Coordination:
  Work with marketing, supply chain, manufacturing, and service teams to ensure readiness and scalability of solutions.
• Business Acumen:
  Demonstrate business insight with clear understanding of value proposition, feature interdependencies, and business value
• Technical Breadth:
  Demonostrate technical competency to ensure development plans are comprehensive to meet performance, reliability, cost, manufacturability, and serviceability goals

The successful candidate will have the following skills.

• Software development experience with good software design exposure is desired.
• Experience with New Product Introduction or Product Development Experience from inception to delivery.
• Proven Technical Capability and Risk Management with deep understanding of business goals.
• Experience articulating the progress and impact through relevant key performance indicators.
• Familiarity with Agile, Iterative, and Waterfall development methodologies.
• Great team player with strong leadership, critical thinking, and…