Die Attach Operator Level 2

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Full Time- ISV Manufacturing Labor Milpitas, CA, US

2 days ago Requisition

Salary Range: $20.00 To $24.00 Hourly

Job Code: 25550, 25551, 25552, 25553 Date Created: 8/15/2022

Reports To:

Production Manager Date Revised: 8/15/2022

Perform automatic and manual die bonding with various equipment that bonds integrated circuit dies to substrates, lead frames and package cavity.

• Operate Stud Pull Test procedure and certified spec.
• Operate Die Shear Process Test Procedure and certified specifications.
• Operate and inspect X-ray.
• Operate XYZ Micro VU measurement tool.
• Recognize and select fixture and tooling.
• Operate UV cure.
• Recall and select profile for die attach reflow on RTC furnace silver glass.
• Recall and select profile for die attach reflow on WJ furnace hermetic and solder paste.
• Recall plasma machine program per traveler instruction.
• Clean procedure (remove flux) bake.
• Manual dam & fill can control fillet around the die given less space on cavity of the package.
• Manual under fill and cure process.
• Operate Flip Chip Attach “SEC” machine.
• Operate Asymtek dispensing machine – old and new version.
• Operate MAT 6400 and Datacon.

• Mix glass beads in to epoxy follow the mix ration.
• Die attach with customer consigned epoxy (high or low viscosity).
• Manual attach DAP die without epoxy.
• Manual stacks dies attach or components attach.
• Tiny die (less than 0.015”) use wood stick pickup epoxy for DA. Thin die (less than 0.006”) use wood stick pickup epoxy for DA.
• Manual or Auto dispense and attach stiffener to device.
• Recall Program Flip Chip Attach “SEC machine”.
• Recall program on Asymtek dispensing machine – old and new version.
• Recall program on MAT 6400.
• Recall program Datacon Operation.
• Recall profile for silver glass reflow on RTC Furnace and Glass Seal.
• Recall profile for die attach reflow on WJ Furnace Hermetic and Solder paste.

• Select Eutectic Die Attach tooling, setup heat block temperature and operate machine.
• Setup Eutectic Die Attach machine included temperature.
• Setup new program Flip Chip Attach “SEC Machine”.
• Setup new program on Asymtek dispensing machine old and new version.
• Setup New Program on MAT 6400.
• Setup New Program on Datacon Operation.

• Set-up and operate automatic/manual Die Attach, Flip Chip and Dispenses equipment.
• O perate a variety of equipment, including high-powered microscopes, with speed and accuracy.
• Follow job traveler instructions accurately.
• Identify and report process deviations to supervisor.
• Meet quality goals, safety requirements, and follow company policies.
• Flexibility to perform other duties as assigned.

Education:

High School diploma or above required.

• 6 months of semiconductor assembly in a Production environment preferred.
• Experience in second optical inspection may be applicable.

• Experience with:
• Manual Die Attach operation, Microscope and manual Dispense equipment (EFD, etc.).
• Manual Dam & Fill operation and automatic equipment (Asymtek, etc.)
• Automatic Die Attach bonders (Datacon, MAT
  6400, etc.)
• Semi-automatic Flip Chip bonders (SEC
  860, etc.)

Total Number of Employees Directly Supervising:
_0_

Number of Subordinate Supervisors Reporting to Position:
_0_

This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified.

In addition, this is not an employment contract and should not be construed or interpreted as…