Sr. Electrical Design Engineer; Firmware, DSP, Image Alignment

To make electronics, you need chips, wafers, transistors, reticles, and... To make these, you must see, test and manufacture them at scale—faster and better than ever before. That's where KLA comes in. Whether you're early in your career or an experienced professional, you'll solve complex challenges, work alongside brilliant minds and help shape the future of technology.

Group/Division The Semiconductor Products and Customers (Semi PC) business unit designs, builds and sells KLA’s product portfolio to help chip manufacturers meet high-quality standards for technologies like AI, data centers, automotive and electronic devices. Our inspection, metrology, and analytics systems detect and monitor defects across logic and memory chips, specialty semiconductors, wafers, reticles, advanced packaging, process equipment and materials. We also develop technologies for specialty processes, IC substrates, and PCB manufacturing, including etch and deposition, component inspection, and imaging and analytics.

The Broadband Plasma (BBP) division is the market‑leading optical inspection system used by logic, foundry, and memory customers to detect critical defects at advanced nodes. These tools combine broadband plasma technology with unmatched sensitivity and speed to support high‑volume manufacturing.

In this role, you will play a key part in advancing business priorities by delivering high‑impact work across your area of expertise. We are looking for a Sr. Electrical Design Engineer to join our team in Milpitas! In this hands‑on role, you will develop embedded firmware and algorithms for KLA's run‑time alignment systems, connecting image‑based measurements with precision motion control. You will help advance our alignment architecture, migrate and optimize algorithms across computing platforms, and deliver reliable solutions from concept through system qualification and field deployment.

• Design, implement, and debug C/C++ firmware for real‑time image alignment, signal processing, and feedback control on embedded Linux and DSP-based platforms.
• Migrate alignment algorithms from host processors to multicore DSPs; profile and optimize execution time, memory use, data movement, and synchronization while preserving numerical accuracy and real‑time behavior.
• Develop and validate image‑offset estimation, digital filtering, and confidence‑based alignment methods that remain robust under low‑contrast, repetitive‑pattern, and other challenging imaging conditions.
• Partner with motion‑control and algorithm engineers to integrate image‑based measurements into stage feedback and trajectory correction; characterize accuracy, noise, latency, and control‑loop behavior.
• Define and implement hardware/software interfaces across processors, FPGAs, image‑acquisition electronics, and motion controllers, including data formats, buffering, interrupts, and communication timing.
• Bring up and integrate hardware and firmware using schematics, device datasheets, lab instruments, and embedded debugging tools; isolate system‑level failures across hardware, firmware, and software.
• Own verification from simulation and bench testing through on‑system qualification.
• Build automated regression tests, compare migrated algorithms with reference implementations, and document performance and robustness results.
• Support controlled firmware releases and field escalations through reproducible diagnostics, root‑cause analysis, configuration/version traceability, and clear documentation for engineering, manufacturing, and service teams.

• Strong C/C++ programming skills in embedded environments, including debugging, concurrency, memory management, and performance optimization; proficiency in Python…