Mechanical Stress Simulation Staff Engineer

Job  : 2401 E 86th St, Bloomington, MN 55425, USAPosted:
Bold Thinking. World Changing. At Sky Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world. Explore what’s possible.

Joining our U.S.

- based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few.

Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services. Step into the future. Sky Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking? Find your place on our team and help us change the world! Sky Water is hiring a Mechanical Stress Simulation Staff Engineer to be responsible for executing advanced mechanical stress simulations for semiconductor advanced packaging, heterogeneous integration, and BEOL (Back-End-Of-Line) metallization layers. This role leverages industry-leading software tools to model, analyze, and optimize mechanical and thermal behaviors in complex semiconductor structures, ensuring reliability and performance across device, die, chip, and package levels.

Key Responsibilities:

Develop and execute multi-level mechanical stress models for semiconductor devices, circuits, dies, chips, and packaging. Simulate elastic, viscoelastic, and crack-related phenomena, including recoverable stress/strain, plastic deformation, delamination, and crack propagation, with direct impact on device performance and BEOL reliability. Utilize advanced simulation software such as ANSYS, TCAD Sentaurus, SInterconnect, and Multi Physics Fusion to analyze mechanical stress, heat transfer, and dissipation in semiconductor packaging and BEOL layers.

Plan test structures to characterize material properties (bulk modulus, shear modulus, coefficient of thermal expansion, binding strength) required for simulation and reproducing shortloop experiments. Collaborate with process integration teams to utilize simulation results in design and manufacturing workflows. Document methodologies, results, and recommendations for reliability improvements and yield enhancement. Required Skills &

Qualifications:

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field with 3+ years of related experience.

Experience with crack/delamination analysis and BEOL processes/materials. Proficiency in finite element analysis (FEA) and simulation methodologies. Hands-on expertise with mechanical simulation tools (ANSYS, Sentaurus, Multi Physics Fusion, AutoCAD, Solid Works). Familiarity with semiconductor packaging systems and BEOL materials. Strong analytical, problem-solving, and communication skills.

Preferred Experience:

Prior work in semiconductor industry, especially in packaging and BEOL.…