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Senior Optical Packaging & Flip-Chip Process Architect

Job in Montréal, Province de Québec, H2B, Canada
Listing for: Sanmina-SCI Systems de México
Full Time position
Listed on 2026-01-28
Job specializations:
  • Engineering
    Systems Engineer
Salary/Wage Range or Industry Benchmark: 145000 - 165000 CAD Yearly CAD 145000.00 165000.00 YEAR
Job Description & How to Apply Below
A leading technology firm is seeking an industry expert in Ottawa to lead process architecture and development for next-generation optical and microelectronic solutions. The role requires deep expertise in flip-chip and wire bonding processes, with a Master's degree in a relevant engineering discipline and at least 8 years of practical experience. You will define assembly strategies, develop critical process recipes, and mentor junior engineers while working on cutting-edge technologies.

A competitive salary between $145,000 and $165,000 annually is offered.
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Position Requirements
10+ Years work experience
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