Senior Mechanical Engineer; Semiconductor Packaging

Position: Senior Mechanical Engineer (Semiconductor Packaging)
About Inpho
Inpho is a fast-growing startup, focused on developing cutting-edge optoelectronic solutions for next-generation communications, and photonic systems. Our multidisciplinary team is pushing the boundaries of innovation in integrated photonics and semiconductor packaging.

Inpho’s new class of electro-photonic chips is poised to revolutionize and disrupt the optical interconnect market. Utilizing this new class of chips enables existing optical interconnect systems to be built at much lower cost; new architectures to be deployed that provide significantly higher price/performance; and a whole new generation of higher speed interconnect to be built that to date have been impossible.

About the Role
We are looking for a Senior Mechanical Engineer who thrives at the intersection of precision design and robust process development to help us bring our optical subassemblies to the global market. You will own the mechanical lifecycle of our optical subassemblies and will be responsible for how our products are built, tested, and scaled. You will bridge the gap between initial optoelectronic design and reliable prototyping and mass production, ensuring our hardware meets the rigorous demands of the telecom and datacom industry.

Key Responsibilities

Mechanical Design:  Lead the end-to-end physical design of sophisticated optomechanical components and assemblies using CAD tools (Solid Works).

Tolerance Budgeting & GD&T:  Perform 3D tolerance stack-up analyses and apply Geometric Dimensioning and Tolerancing (GD&T per ASME Y14.5) to define precise models and manufacturing drawings for micro-scale optical assemblies.

Precision Tooling & Fixture Development:  Design high-precision custom test setups and assembly fixtures to support R&D lab for prototype build and electro-optical characterizations, as well as production line for high-volume manufacturing.

Semiconductor Packaging:  Support Designing and optimizing semiconductor/optoelectronic packaging design, focusing on thermal management, material selection and structural integrity.

Test Automation & Scripting:  Develop custom automation scripts and control software (e.g., Python, LabVIEW, or VBA/SOLIDWORKS macros) to automate benchtop test fixtures and electro-optical measurement workflows.

BOM and PDM Management:  Manage multi-level Bills of Materials (BOMs) and product configuration structures within Product Data Management (PDM) system, ensuring accuracy throughout the product lifecycle and coordinating with procurement.

Prototyping & Validation:  Take a hands-on approach to building, testing, and validating parts and assemblies in the R&D lab.

DFMEA & Failure Analysis (FA):  Partner with internal and external reliability and FA experts to conduct DFMEA and perform root-cause analysis on mechanical/packaging failure modes during prototype builds.

Vendor & OSAT

Collaboration:

Collaborate with machining vendors, tooling suppliers and OSAT partners to oversee component fabrication and qualification and facilitate the seamless transfer of components from R&D to production.

Cross-Functional Collaboration:

Partner daily with packaging, electrical, optical, and production engineers as well as operations team to solve complex opto-mechanical design and integration challenges.

Qualifications

Education:

Bachelor’s or Master’s degree in mechanical engineering, engineering physics or materials science and engineering.

Experience:

7+ years (with a Bachelor’s degree) or 5+ years (with a Master’s degree) of validated industrial development experience in semiconductor industry.

CAD Mastery and Tolerance Analysis:  Advance proficiency in CAD tools for 3D model design and 2D drawings creation (using Solid Works or Creo) with demonstrated expertise in GD&T and tolerance…