Job Description & How to Apply Below
In this pivotal position, you'll leverage your 10+ years of experience in advanced optical packaging and photonic assembly. You'll drive processes from development through to manufacturing transfer, working collaboratively with design teams, suppliers, and manufacturing partners. This hands-on role demands expertise in flip-chip and BGA assembly, fiber attachment, and thermal management.
Key Responsibilities:
• Develop packaging and assembly strategies based on product requirements
• Lead flip-chip bonding and fine-pitch die attachment processes
• Oversee hybrid integration of lasers and optical components
• Manage fiber-array attach processes and inspection methods
• Define tooling and SOPs for production ramp-up
Requirements:
• 10+ years in advanced optical or semiconductor packaging
• Hands-on flip-chip and optical alignment experience
• Strong knowledge of materials and manufacturing processes
• Proven ability to manage external partners
• Excellent communication and technical judgment
Bring your innovative mindset and technical expertise to Ranovus and drive the future of optical packaging technology.
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