AI Thermal Engineer Liquid Cooling

Lead thermal design for AI accelerators in Ottawa, using CFD modeling and Direct-to-Chip liquid cooling for high-density compute platforms.
Broadcom seeks an experienced AI Systems Thermal Engineer for full-time work on next-generation AI hardware. You will own thermal-hydraulic performance across cold plates, interface materials, and fluid delivery subsystems. The work spans concept through mass production, collaborating with silicon package, board layout, mechanical housing, and manufacturing teams.

Key Responsibilities:

Build CFD and thermal-resistance network models
Co-design liquid cold plates with industry partners
Specify and qualify thermal interface materials
Design coolant paths, hoses, and quick-disconnects
Execute lab testing and simulation correlation
Requirements:
Bachelor’s or Master’s degree in Mechanical or Thermal Engineering
Eight years’ experience with a Bachelor’s, or six with a Master’s
Direct Liquid Cooling systems experience

Experience with cold plates, CDUs, and manifold loops
Proficiency with CFD and thermal analysis software
Apply thermal-hydraulic expertise, electronics cooling knowledge, and lab validation skills to Broadcom’s AI hardware systems in Ottawa.