Lead Hardware Engineering Manager - Electronics Packaging
Listed on 2026-10-07
-
Engineering
Operations Management -
Management
Operations Management
Lockheed Martin is seeking a First Line Manager for the Electronics Packaging group within the Sensors mechanical Design and Test organization. You will lead a team of about 20 engineers, drive hardware development processes, and oversee radar packaging designs to meet customer contracts and company standards.
The role requires a bachelor’s in mechanical engineering or related field, with extensive experience in electronics packaging, and the ability to obtain a SECRET clearance.
The Lead Hardware Engineering Manager
- Electronics Packaging position in the Engineering field is open for applications.
The Lead Hardware Engineering Manager
- Electronics Packaging role at Lockheed Martin is now open for applications in Moorestown Township, NJ, United States.
Join us at Lockheed Martin as our next Lead Hardware Engineering Manager
- Electronics Packaging in Moorestown Township, NJ, United States.
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