Process Development Engineering Intern

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers' success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!
** Process Development Engineering Intern
**** Responsibilities:**- Developing Backend Assembly Process and/or Package Developments for RF Power products
- Participate in technology development projects which may include: defining the specifications, guidelines and developing assembly processes with process recipe development, equipment upgrade and material selection
- Anticipate and propose solution to mitigate potential issues and limitation of process/material/equipment throughout the development stages.

- Perform continuous improvement activities of existing assembly processes, equipment and materials for quality improvement and cost saving
- Design new customized tooling to adopt off the shelf equipment for our high-volume production.

- Perform verification and qualification activities for new tooling, machine and materials in development projects
- Work directly with equipment vendors, subcontractors and internal team to qualify, bring up and debug equipment.

- Creation, regular review and updating of design & equipment process FMEA
- Technical support on Manufacturing with troubleshooting and providing technical solution
- Participate in new product introduction with material selection, process developments, and data review, as technical expert
- Conduct risk assessments and mitigation as well as project reviews and report the results to the executive level on a regular basis
- Coordinate and support initial mechanical reliability test with failure analysis for root cause finding
** Requirements:**- BS. MS preferably in mechanical, material, industrial Engineering, Material Engineering, Applied Science, or other relevant qualification
- Minimum 8+ years of relevant experience in the function of package and assembly process development such as die attach, SMT, Lid attach.

- Must be able to utilize die bond equipment such as Datacon EVO.

- Possess in depth technical knowledge and hands on experience on semiconductor backend assembly processes for RF Power Packages
- Hands on experience on engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.

- Proven experience in project management, document accurately, communicate with intention, report efficiently, pre-empt risk, and drive for the best possible outcome for the customer, for the company, and for the team members
- Solid experience and technical understanding in semiconductor reliability standards and test methods
- Experience in materials characterization and…