Senior Principal Packaging Engineer

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense.  We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies.  Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success.  We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.  Leading technologies, innovative products and driven employees.

Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Senior Principal Packaging Engineer Responsibilities:
• Develop FCMCM package - Define package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost
• Participate in technology development projects which may include: defining the specifications, guidelines and developing assembly processes with process recipe development, equipment upgrade and material selection
• Anticipate and propose solution to mitigate potential issues and limitation of process/material/equipment throughout the development stages.
• Perform continuous improvement activities of existing assembly processes, equipment and materials for quality improvement and cost saving
• Design new customized tooling to adopt off the shelf equipment for our high-volume production.
• Perform verification and qualification activities for new tooling, machine and materials in development projects
• Work directly with equipment vendors, subcontractors and internal team to qualify, bring up and debug equipment.
• Creation, regular review and updating of design & equipment process FMEA
• Technical support on Manufacturing with troubleshooting and providing technical solution
• Conduct risk assessments and mitigation as well as project reviews and report the results to the executive level on a regular basis
• Coordinate and support initial mechanical reliability test with failure analysis for root cause finding

Requirements:
• B.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field.
• 10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related fields.
• Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, SiP/modules, and power packages.
• Knowledge on die attach equipment of Datacon Evo is preferred.
• Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred.
• Ability to communicate technical tradeoffs, risks, recommendations, and project status clearly to both technical and management audiences.
• Experience in materials characterization and analysis, DOE, reliability standards, and FA…