Senior Principal Packaging Engineer - 3D/5D Packaging
Listed on 2026-10-15
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Engineering
Packaging Engineer
MACOM is seeking a Senior Principal Packaging Engineer to lead advanced semiconductor packaging efforts. The role focuses on defining architectures, materials, and processes for high-volume production across diverse package types including QFP, QFN, BGA, and 2.5D/3D strategies.
Candidates should have 10+ years in packaging, a strong mechanical/ materials background, and experience with Datacon Evo equipment.
As a Senior Principal Packaging Engineer - 3D/2.5D Packaging, you will play an important part at MACOM in Morgan Hill, CA, United States.
This position is for the Senior Principal Packaging Engineer - 3D/2.5D Packaging role at MACOM.
We are seeking a motivated Senior Principal Packaging Engineer - 3D/2.5D Packaging to join MACOM in Morgan Hill, CA, United States.
Consider building your career as a Senior Principal Packaging Engineer - 3D/2.5D Packaging at MACOM.
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