Microelectronics Packaging Co-Op — Hands-On Tech & DOE
Listed on 2026-10-06
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Engineering
Packaging Engineer, Manufacturing Engineer, Materials Engineering, Quality Engineering -
Manufacturing / Production
Packaging Engineer, Manufacturing Engineer, Materials Engineering, Quality Engineering
Skyworks is seeking a Microelectronics/Semiconductor Packaging Co-Op/Intern to support advanced packaging tech development. You will work with packaging, manufacturing, quality, and design engineers, plus external partners, to optimize packaging for high-performance products.
This Winter/Spring Coop runs January 2027 to June 2027, requiring a 6-month term before graduation. You will gain hands-on experience in materials evaluation, DOE, data analysis, and cross-functional collaboration within a
The Microelectronics Packaging Co-Op — Hands-On Tech & DOE position in the Engineering field is open for applications.
We would love to welcome a new Microelectronics Packaging Co-Op — Hands-On Tech & DOE to our group in Nashua, NH, United States.
For the Microelectronics Packaging Co-Op — Hands-On Tech & DOE position at Skyworks, we are reviewing applications now.
Step into the Microelectronics Packaging Co-Op — Hands-On Tech & DOE role at Skyworks in Nashua, NH, United States and grow with us.
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