Advanced Materials and Technology Engineer - PCB

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales.

We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Amphenol’s High-Speed Backplane Connector business unit is seeking a highly specialized technical expert to help define and develop the future of copper-based backplane interconnect technology. This role is focused on enabling the next generation of high-speed signal transmission in backplane architectures, with a long-term goal of achieving 448G and beyond performance using copper backplane connectors.

The ideal candidate will be a hands-on technical leader with deep expertise in PCB fabrication technology and PCB materials, substrate and package fabrication, signal integrity and high-speed interconnect design. This individual will serve as a key subject matter expert on the PCB and its interaction with connector and system-level architecture, helping bridge the gap between emerging technology concepts and practical product development.

• Work closely with external PCB suppliers to influence industry direction and future product requirements.
• Provide technical guidance and mentorship across engineering teams on PCB and backplane-related topics.
• Support customer engagements by translating advanced technical concepts/needs into practical design recommendations.
• Lead research and development efforts focused on the future of copper in backplane connector systems
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• Serve as the technical expert on PCB design, material selection, stack-up optimization, and electrical performance as it relates to connector integration.
• Investigate, define, and evaluate new architectures and technology concepts that may not yet exist in the market.
• Collaborate cross-functionally with product development, systems engineering, signal integrity, materials, manufacturing, and customer-facing technical teams.
• Lead the modeling, prototyping and validation advanced PCB stack up solutions for high-speed applications with our external partners.
• Identify technical barriers and create development roadmaps to overcome limitations in copper-based transmission.

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a closely related technical field.
• Extensive experience in high-speed PCB fabrication, signal integrity, and/or advanced interconnect development
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• Strong background in backplane architecture and copper transmission systems
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• Substrate and package fabrication knowledge is a plus.
• Demonstrated expertise in PCB technology and how it impacts end-to-end electrical performance.
• Ability to evaluate emerging technologies and develop forward-looking technical strategies.
• Excellent analytical, problem-solving, and cross-functional collaboration skills.

• Experience with 56G, 112G, 224G, 448G
  , or similarly advanced high-speed signaling environments is a plus.
• Background in connector development, high-speed channel design, or advanced package/board-level integration is a plus.

• Recognized technical expert in…